Application of analytical TEM for failure analysis of semiconductor device structures
Veröffentlichungsart | Zeitschriften-/Journalbeitrag (peer-reviewed) |
|---|---|
Medien | Microelectronics Reliability |
Veröffentlichungsdatum | 2000-10-01 |
Band | 2000/40 |
Heft | 8-9 |
Seiten | 1747-1751 |
DOI | |
Zitierung | Engelmann, Hans-Jürgen; Saage, Holger; Zschech, E. (2000): Application of analytical TEM for failure analysis of semiconductor device structures. Microelectronics Reliability 2000/40 (8-9), S. 1747-1751. DOI: 10.1016/S0026-2714(00)00107-4 |
Peer Reviewed | Ja |
Autoren |
Hans-Jürgen Engelmann |